PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Xeon E3-1226 v3 is manufactured by Intel. It was released in 11 May 2014 (11 years ago). It is based on the Haswell-WS (2013−2014) architecture. It features 4 cores and 4 threads. Base frequency is 3.3 GHz, with boost up to 3.7 GHz. L3 cache: 8 MB (total). L2 cache: 256K (per core). Built on 22 nm process technology. Socket: LGA1150. Thermal design power (TDP): 84 Watt. Memory support: DDR3. Passmark benchmark score: 5,529 points. Launch price was $213.

Value Upgrade Path

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MSRP is the manufacturer's suggested retail price.•
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Performance Per Dollar

Based on actual market prices and performance synthetic scores.

FPS Benchmarks

Predicted performance for Xeon E3-1226 v3 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Technical Analysis

Detailed breakdown of Xeon E3-1226 v3 specifications and capabilities.

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Processing Power

The Xeon E3-1226 v3 is a 4-core / 4-thread processor based on the Haswell-WS (2013−2014) architecture, manufactured on a 22 nm process node. It reaches a maximum boost clock of 3.7 GHz from a base frequency of 3.3 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 8 MB (total) of L3 cache, plus 256K (per core) of L2 cache and 64K (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 5,529, placing it in the Entry Level performance tier as a Legacy generation product.

Specification	Xeon E3-1226 v3
Cores / ThreadsPhysical/logical processing units	4C / 4T
Max Boost ClockPeak single-core speed under boost	3.7 GHz
Base ClockGuaranteed minimum operating frequency	3.3 GHz
ArchitectureCPU microarchitecture design	Haswell-WS (2013−2014)
Process NodeFabrication technology — smaller = more efficient	22 nm
L3 CacheShared cache — reduces memory latency for all cores	8 MB (total)
L2 CachePer-core fast cache for frequently accessed data	256K (per core)
L1 CacheUltra-fast per-core cache	64K (per core)
Die SizePhysical silicon area of the processor	160 mm2
Transistor CountMore transistors = more capabilities	1,400 million
Bus SpeedData bus frequency	5 GT/s
64-bit Support	Yes
Windows 11 Compatible	No
PassMark ScoreOverall multi-threaded benchmark score	5,529

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Memory & Platform

The Xeon E3-1226 v3 fits into the LGA1150 socket and supports PCIe 3.0. It supports DDR3 memory.

Specification	Xeon E3-1226 v3
TypeDesktop or Laptop processor	server
SeriesProduct family	Xeon (Desktop)
SocketMotherboard socket required	LGA1150
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth	PCIe 3.0
RAM TypeSupported memory standard	DDR3
Max CPUs in ConfigMulti-socket support for servers	1

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Power & Cooling

The Xeon E3-1226 v3 has a rated TDP (Thermal Design Power) of 84 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed.

Specification	Xeon E3-1226 v3
TDPThermal Design Power — heat output under sustained workload	84 Watt

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Value Analysis

Performance ranking position: #1794 out of all indexed processors.

Specification	Xeon E3-1226 v3
Launch PriceOriginal retail price at launch	$213
Performance RankPosition in overall performance ranking	#1794
Release DateLaunch date	11 May 2014 (11 years ago)
Release Year	2014
DesignerArchitecture designer (e.g. Intel, AMD)	Intel
ManufacturerFabrication foundry (e.g. TSMC)	Intel

Specifications Reference

Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.

4 categories

General Information

8 specs

Type	server
Series	Xeon (Desktop)
Designer	Intel
Launch Price	$213
Manufacturer	Intel
Release Date	11 May 2014 (11 years ago)
Architecture Codename	Haswell-WS (2013−2014)
Performance Ranking Position	1794

Technical Specifications

13 specs

Cores	4
Threads	4
Die Size	160 mm2
L1 Cache	64K (per core)
L2 Cache	256K (per core)
L3 Cache	8 MB (total)
Bus Speed	5 GT/s
Max Frequency	3.7 GHz
64-Bit Support	+
Base Frequency	3.3 GHz
Transistor Count	1,400 million
Process Technology	22 nm
Windows 11 Compatible	-