CPU·Budget

Sempron 3850

AMD

PassMark

1,168

2007-01-01

25 Watt

Kabini (2013−2014)

Performance Spectrum - CPU

Sempron 3850

4 / 4

1,168

0.0%

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About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Sempron 3850 is manufactured by AMD. It was released in 2007-01-01. It is based on the Kabini (2013−2014) architecture. It features 4 cores and 4 threads. Max frequency: 1.3 GHz. L2 cache: 2048 kB. Built on 28 nm process technology. Socket: AM1. Thermal design power (TDP): 25 Watt. Memory support: DDR3-1600. Passmark benchmark score: 1,168 points. Launch price was $69.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.•
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

FPS Benchmarks

Predicted performance for Sempron 3850 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Technical Analysis

Detailed breakdown of Sempron 3850 specifications and capabilities.

⚡

Processing Power

The Sempron 3850 is a 4-core / 4-thread processor based on the Kabini (2013−2014) architecture, manufactured on a 28 nm process node. It reaches a maximum boost clock of 1.3 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 1,168, placing it in the Entry Level performance tier as a Legacy generation product.

Specification	Sempron 3850
Cores / ThreadsPhysical/logical processing units	4C / 4T
Max Boost ClockPeak single-core speed under boost	1.3 GHz
ArchitectureCPU microarchitecture design	Kabini (2013−2014)
Process NodeFabrication technology — smaller = more efficient	28 nm
L2 CachePer-core fast cache for frequently accessed data	2048 kB
L1 CacheUltra-fast per-core cache	256 kB
Die SizePhysical silicon area of the processor	107 mm2
Max TemperatureMaximum safe operating temperature (Tjmax)	90 °C
64-bit Support	Yes
PassMark ScoreOverall multi-threaded benchmark score	1,168

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Memory & Platform

The Sempron 3850 fits into the AM1 socket and supports PCIe 2.0. It supports DDR3-1600 memory.

Specification	Sempron 3850
TypeDesktop or Laptop processor	desktop
SocketMotherboard socket required	AM1
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth	PCIe 2.0
RAM TypeSupported memory standard	DDR3-1600
Max CPUs in ConfigMulti-socket support for servers	1

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Power & Cooling

The Sempron 3850 has a rated TDP (Thermal Design Power) of 25 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed.

Specification	Sempron 3850
TDPThermal Design Power — heat output under sustained workload	25 Watt
Max TemperatureMaximum safe junction temperature (Tjmax)	90 °C

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Value Analysis

Performance ranking position: #2967 out of all indexed processors.

Specification	Sempron 3850
Launch PriceOriginal retail price at launch	$69
Performance RankPosition in overall performance ranking	#2967
Release DateLaunch date	2007-01-01
Release Year	2014
DesignerArchitecture designer (e.g. Intel, AMD)	AMD
ManufacturerFabrication foundry (e.g. TSMC)	GlobalFoundries

Specifications Reference

Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.

4 categories

General Information

7 specs

Type	desktop
Designer	AMD
Launch Price	$69
Manufacturer	GlobalFoundries
Release Date	2007-01-01
Architecture Codename	Kabini (2013−2014)
Performance Ranking Position	2967

Technical Specifications

10 specs

Cores	4
Threads	4
Die Size	107 mm2
L1 Cache	256 kB
L2 Cache	2048 kB
Max Frequency	1.3 GHz
64-Bit Support	+
Process Technology	28 nm
Max Core Temperature	90 °C
Max Case Temperature (TCase)	90 °C