Mobile Sempron 3300+
AMD
PassMark
376
Performance Spectrum - CPU
About PassMark
PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.
Overview
The Mobile Sempron 3300+ is manufactured by AMD. It was released in 1 June 2005 (20 years ago). It is based on the Roma (2005) architecture. It features 1 cores and 1 threads. Max frequency: 2 GHz. L2 cache: 128 kB. Built on 90 nm process technology. Socket: 745. Thermal design power (TDP): 128 kB. Passmark benchmark score: 376 points. Launch price was $69.
Value Upgrade Path
This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.
Avg price is the current average price collected from markets across the web.
Performance Per Dollar
FPS Benchmarks
Predicted performance for Mobile Sempron 3300+ across popular games. Tested paired with RTX 4090 to isolate CPU performance.
Counter-Strike 2
Dead by Daylight
Garry's Mod
League of Legends
Left 4 Dead 2
Monster Hunter Wilds
Once Human
Path of Exile 2
Phasmophobia
Project Zomboid
Technical Analysis
Detailed breakdown of Mobile Sempron 3300+ specifications and capabilities.
Processing Power
The Mobile Sempron 3300+ is a 1-core / 1-thread processor based on the Roma (2005) architecture, manufactured on a 90 nm process node. It reaches a maximum boost clock of 2 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 376, placing it in the Entry Level performance tier as a Legacy generation product.
| Specification | Mobile Sempron 3300+ |
|---|---|
| Cores / ThreadsPhysical/logical processing units | 1C / 1T |
| Max Boost ClockPeak single-core speed under boost | 2 GHz |
| ArchitectureCPU microarchitecture design | Roma (2005) |
| Process NodeFabrication technology — smaller = more efficient | 90 nm |
| L2 CachePer-core fast cache for frequently accessed data | 128 kB |
| Bus SpeedData bus frequency | 800 MHz |
| 64-bit Support | No |
| Windows 11 Compatible | No |
| PassMark ScoreOverall multi-threaded benchmark score | 376 |
Memory & Platform
The Mobile Sempron 3300+ fits into the 745 socket and supports PCIe 2.0.
| Specification | Mobile Sempron 3300+ |
|---|---|
| TypeDesktop or Laptop processor | Laptop |
| SeriesProduct family | AMD Mobile Sempron |
| SocketMotherboard socket required | 745 |
| PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth | PCIe 2.0 |
Power & Cooling
The Mobile Sempron 3300+ has a rated TDP (Thermal Design Power) of 128 kB — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed.
| Specification | Mobile Sempron 3300+ |
|---|---|
| TDPThermal Design Power — heat output under sustained workload | 128 kB |
Value Analysis
Performance ranking position: #3542 out of all indexed processors.
| Specification | Mobile Sempron 3300+ |
|---|---|
| Launch PriceOriginal retail price at launch | $69 |
| Performance RankPosition in overall performance ranking | #3542 |
| Release DateLaunch date | 1 June 2005 (20 years ago) |
| Release Year | 2005 |
| DesignerArchitecture designer (e.g. Intel, AMD) | AMD |
Specifications Reference
Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.
3 categories
General Information
7 specs
General Information
7 specs
| Type | Laptop |
| Series | AMD Mobile Sempron |
| Designer | AMD |
| Launch Price | $69 |
| Release Date | 1 June 2005 (20 years ago) |
| Architecture Codename | Roma (2005) |
| Performance Ranking Position | 3542 |
Technical Specifications
8 specs
Technical Specifications
8 specs
| Cores | 1 |
| Threads | 1 |
| L2 Cache | 128 kB |
| Bus Speed | 800 MHz |
| Max Frequency | 2 GHz |
| 64-Bit Support | - |
| Process Technology | 90 nm |
| Windows 11 Compatible | - |
Compatibility
3 specs
Compatibility
3 specs
| Socket | 745 |
| PCIe Generation | PCIe 2.0 |
| Power Consumption (TDP) | 128 kB |
Similar Performance
Processors with benchmark scores closest to the current hardware, grouped by manufacturer.
Intel (8)
AMD (8)
Our Recommendation for Mobile Sempron 3300+
Suggested pairings based on performance balance
Minimum (Avoid Bottleneck) (12)
Recommended (Balanced) (12)
High-End (Max Performance) (12)
Popular Comparisons
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Compare Mobile Sempron 3300+
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