Ryzen AI 9 HX 370

The Ryzen AI 9 HX 370 is a 12-core / 24-thread processor based on the Strix Point (2024−2025) architecture, manufactured on a 4 nm process node. It reaches a maximum boost clock of 5.1 GHz from a base frequency of 2 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 24 MB (total) of L3 cache, plus 1 MB (per core) of L2 cache and 80 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 35,133, placing it in the High-End performance tier as a Recent generation product.

The Ryzen AI 9 HX 370 fits into the FP8 socket and supports PCIe 4.0 with 16 total PCIe lanes for expansion cards and storage. It supports DDR5 memory at speeds up to 7500 (faster RAM improves bandwidth-sensitive workloads), with a maximum capacity of 256 across 2 channels (dual-channel doubles bandwidth). Integrated graphics: AMD Radeon 890M — allows display output without a dedicated GPU, useful for troubleshooting and light tasks.

It supports AVX-512 instructions — specialized SIMD operations that significantly accelerate AI inference, scientific computing, and video encoding workloads. Virtualization: AMD-V, SVM — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Core Ultra 9 185H.

The Ryzen AI 9 HX 370 has a rated TDP (Thermal Design Power) of 28 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. No stock cooler is included — you will need to purchase an aftermarket cooler separately. Recommended cooling: High-end Laptop Cooling.

Performance ranking position: #341 out of all indexed processors.