Ryzen AI 9 HX 375
CPU·Mid-Range

Ryzen AI 9 HX 375

AMD

PassMark

34,585

00
Julho 2024 (1 year ago)
28 Watt
Strix Point-HX (Zen 5) (2024)

Performance Spectrum - CPU

About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Ryzen AI 9 HX 375 is manufactured by AMD. It was released in Julho 2024 (1 year ago). It is based on the Strix Point-HX (Zen 5) (2024) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 34,585 points. Launch price was $499.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

Technical Analysis

Detailed breakdown of Ryzen AI 9 HX 375 specifications and capabilities.

Processing Power

The Ryzen AI 9 HX 375 is a 12-core / 24-thread processor based on the Strix Point-HX (Zen 5) (2024) architecture, manufactured on a 4 nm process node. It reaches a maximum boost clock of 5.1 GHz from a base frequency of 2 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 16 MB of L3 cache, plus 1 MB (per core) of L2 cache and 80 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 34,585, placing it in the High-End performance tier as a Recent generation product. Geekbench 6 single-core (the most relevant metric for gaming FPS) records 2,865, while multi-core reaches 15,100. Cinebench R23 multi-core (measuring sustained rendering workload performance) scores 22,246.

SpecificationRyzen AI 9 HX 375
Cores / ThreadsPhysical/logical processing units12C / 24T
Max Boost ClockPeak single-core speed under boost5.1 GHz
Base ClockGuaranteed minimum operating frequency2 GHz
ArchitectureCPU microarchitecture designStrix Point-HX (Zen 5) (2024)
Process NodeFabrication technology — smaller = more efficient4 nm
L3 CacheShared cache — reduces memory latency for all cores16 MB
L2 CachePer-core fast cache for frequently accessed data1 MB (per core)
L1 CacheUltra-fast per-core cache80 kB (per core)
Die SizePhysical silicon area of the processor233 mm2
Max TemperatureMaximum safe operating temperature (Tjmax)100 °C
64-bit SupportYes
PassMark ScoreOverall multi-threaded benchmark score34,585
Cinebench R23 MultiSustained multi-core rendering performance22,246
Geekbench 6 SingleSingle-core performance — most relevant for gaming2,865
Geekbench 6 MultiMulti-core parallel workload performance15,100
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Memory & Platform

The Ryzen AI 9 HX 375 fits into the FP8 socket and supports PCIe 4.0 with 16 total PCIe lanes for expansion cards and storage. It supports DDR5 memory at speeds up to LPDDR5x-8000, DDR5-5600 (faster RAM improves bandwidth-sensitive workloads), with a maximum capacity of 256 GB across 2 channels (dual-channel doubles bandwidth). Integrated graphics: Radeon 890M — allows display output without a dedicated GPU, useful for troubleshooting and light tasks.

SpecificationRyzen AI 9 HX 375
TypeDesktop or Laptop processorLaptop
SeriesProduct familyAMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9)
SocketMotherboard socket requiredFP8
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidthPCIe 4.0
PCIe LanesTotal available lanes for GPUs, NVMe drives, and expansion16
RAM TypeSupported memory standardDDR5
Max RAM SpeedMaximum officially supported memory frequencyLPDDR5x-8000, DDR5-5600
Max RAM CapacityMaximum installable memory256 GB
RAM ChannelsDual-channel doubles bandwidth vs single-channel2
ECC SupportError-Correcting Code memory — prevents data corruptionNo
Integrated GPUBuilt-in graphics processorRadeon 890M
Compatible ChipsetsMotherboard chipsets that support this CPUSoC
Max CPUs in ConfigMulti-socket support for servers1
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Advanced Features

The Ryzen AI 9 HX 375 is primarily designed for AI-Notebook. It supports AVX-512 instructions — specialized SIMD operations that significantly accelerate AI inference, scientific computing, and video encoding workloads. Virtualization: AMD-V, AMD-Vi — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Ryzen AI 9 HX 370.

SpecificationRyzen AI 9 HX 375
Primary Use CaseIntended workload categoryAI-Notebook
OverclockingWhether CPU clock can be manually increased🔒 Locked
AVX-512Advanced vector instructions for AI/ML workloads✅ Supported
VirtualizationHardware-assisted virtualization technologyAMD-V, AMD-Vi
Direct CompetitorMarket equivalent from rival manufacturerRyzen AI 9 HX 370
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Power & Cooling

The Ryzen AI 9 HX 375 has a rated TDP (Thermal Design Power) of 28 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. No stock cooler is included — you will need to purchase an aftermarket cooler separately. Recommended cooling: Integrated laptop cooling.

SpecificationRyzen AI 9 HX 375
TDPThermal Design Power — heat output under sustained workload28 Watt
Max TemperatureMaximum safe junction temperature (Tjmax)100 °C
Included CoolerStock cooler bundled in the boxNo
Recommended CoolerSuggested aftermarket cooling solutionIntegrated laptop cooling
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Value Analysis

Performance ranking position: #348 out of all indexed processors.

SpecificationRyzen AI 9 HX 375
MSRPManufacturer's Suggested Retail Price$0
Avg Price (30d)Average market price over the last 30 days$0
Launch PriceOriginal retail price at launch$499
Performance RankPosition in overall performance ranking#348
Release DateLaunch dateJulho 2024 (1 year ago)
Release Year2024
DesignerArchitecture designer (e.g. Intel, AMD)AMD
ManufacturerFabrication foundry (e.g. TSMC)TSMC

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