PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Xeon L5639 is manufactured by Intel. It was released in 2015-01-01. It is based on the Westmere-EP (2010−2011) architecture. It features 6 cores and 12 threads. Base frequency is 2.133 GHz, with boost up to 2.67 GHz. L3 cache: 12 MB (total). L2 cache: 256 kB (per core). Built on 32 nm process technology. Socket: LGA1366. Thermal design power (TDP): 60 Watt. Memory support: DDR3. Passmark benchmark score: 4,419 points. Launch price was $800.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.•
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

FPS Benchmarks

Predicted performance for Xeon L5639 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Technical Analysis

Detailed breakdown of Xeon L5639 specifications and capabilities.

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Processing Power

The Xeon L5639 is a 6-core / 12-thread processor based on the Westmere-EP (2010−2011) architecture, manufactured on a 32 nm process node. It reaches a maximum boost clock of 2.67 GHz from a base frequency of 2.133 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 12 MB (total) of L3 cache, plus 256 kB (per core) of L2 cache and 64 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 4,419, placing it in the Entry Level performance tier as a Legacy generation product.

Specification	Xeon L5639
Cores / ThreadsPhysical/logical processing units	6C / 12T
Max Boost ClockPeak single-core speed under boost	2.67 GHz
Base ClockGuaranteed minimum operating frequency	2.133 GHz
ArchitectureCPU microarchitecture design	Westmere-EP (2010−2011)
Process NodeFabrication technology — smaller = more efficient	32 nm
L3 CacheShared cache — reduces memory latency for all cores	12 MB (total)
L2 CachePer-core fast cache for frequently accessed data	256 kB (per core)
L1 CacheUltra-fast per-core cache	64 kB (per core)
Die SizePhysical silicon area of the processor	239 mm2
Transistor CountMore transistors = more capabilities	1,170 million
64-bit Support	Yes
PassMark ScoreOverall multi-threaded benchmark score	4,419

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Memory & Platform

The Xeon L5639 fits into the LGA1366 socket and supports PCIe 4.0. It supports DDR3 memory.

Specification	Xeon L5639
TypeDesktop or Laptop processor	server
SocketMotherboard socket required	LGA1366
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth	PCIe 4.0
RAM TypeSupported memory standard	DDR3
Max CPUs in ConfigMulti-socket support for servers	2

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Power & Cooling

The Xeon L5639 has a rated TDP (Thermal Design Power) of 60 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed.

Specification	Xeon L5639
TDPThermal Design Power — heat output under sustained workload	60 Watt

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Value Analysis

Performance ranking position: #1955 out of all indexed processors.

Specification	Xeon L5639
Launch PriceOriginal retail price at launch	$800
Performance RankPosition in overall performance ranking	#1955
Release DateLaunch date	2015-01-01
Release Year	2011
DesignerArchitecture designer (e.g. Intel, AMD)	Intel
ManufacturerFabrication foundry (e.g. TSMC)	Intel

Specifications Reference

Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.

4 categories

General Information

7 specs

Type	server
Designer	Intel
Launch Price	$800
Manufacturer	Intel
Release Date	2015-01-01
Architecture Codename	Westmere-EP (2010−2011)
Performance Ranking Position	1955

Technical Specifications

12 specs

Cores	6
Threads	12
Die Size	239 mm2
L1 Cache	64 kB (per core)
L2 Cache	256 kB (per core)
L3 Cache	12 MB (total)
Max Frequency	2.67 GHz
64-Bit Support	+
Base Frequency	2.133 GHz
Transistor Count	1,170 million
Process Technology	32 nm
Max Case Temperature (TCase)	69 °C