
Mobile Sempron SI-40
AMD
PassMark
322
Performance Spectrum - CPU
About PassMark
PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.
Overview
The Mobile Sempron SI-40 is manufactured by AMD. It was released in 4 July 2008 (17 years ago). It is based on the Sable (2008−2009) architecture. It features 1 cores and 1 threads. Max frequency: 2 GHz. L2 cache: 512 kB. Built on 65 nm process technology. Socket: S1g2. Thermal design power (TDP): 512 kB. Passmark benchmark score: 322 points. Launch price was $69.
Value Upgrade Path
This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.
Avg price is the current average price collected from markets across the web.
Performance Per Dollar
FPS Benchmarks
Predicted performance for Mobile Sempron SI-40 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Apex Legends

Baldur's Gate 3

Call of Duty: Black Ops 6

Call of Duty: Warzone

Counter-Strike 2

Dead by Daylight

Fortnite

League of Legends

Monster Hunter Wilds

Path of Exile 2
Technical Analysis
Detailed breakdown of Mobile Sempron SI-40 specifications and capabilities.
Processing Power
The Mobile Sempron SI-40 is a 1-core / 1-thread processor based on the Sable (2008−2009) architecture, manufactured on a 65 nm process node. It reaches a maximum boost clock of 2 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 322, placing it in the Entry Level performance tier as a Legacy generation product.
| Specification | Mobile Sempron SI-40 |
|---|---|
| Cores / ThreadsPhysical/logical processing units | 1C / 1T |
| Max Boost ClockPeak single-core speed under boost | 2 GHz |
| ArchitectureCPU microarchitecture design | Sable (2008−2009) |
| Process NodeFabrication technology — smaller = more efficient | 65 nm |
| L2 CachePer-core fast cache for frequently accessed data | 512 kB |
| Bus SpeedData bus frequency | 1800 MHz |
| Max TemperatureMaximum safe operating temperature (Tjmax) | 100 °C |
| 64-bit Support | Yes |
| Windows 11 Compatible | No |
| PassMark ScoreOverall multi-threaded benchmark score | 322 |
Memory & Platform
The Mobile Sempron SI-40 fits into the S1g2 socket and supports PCIe 2.0.
| Specification | Mobile Sempron SI-40 |
|---|---|
| TypeDesktop or Laptop processor | Laptop |
| SeriesProduct family | AMD Mobile Sempron |
| SocketMotherboard socket required | S1g2 |
| PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth | PCIe 2.0 |
Power & Cooling
The Mobile Sempron SI-40 has a rated TDP (Thermal Design Power) of 512 kB — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed.
| Specification | Mobile Sempron SI-40 |
|---|---|
| TDPThermal Design Power — heat output under sustained workload | 512 kB |
| Max TemperatureMaximum safe junction temperature (Tjmax) | 100 °C |
Value Analysis
Performance ranking position: #3515 out of all indexed processors.
| Specification | Mobile Sempron SI-40 |
|---|---|
| Launch PriceOriginal retail price at launch | $69 |
| Performance RankPosition in overall performance ranking | #3515 |
| Release DateLaunch date | 4 July 2008 (17 years ago) |
| Release Year | 2008 |
| DesignerArchitecture designer (e.g. Intel, AMD) | AMD |
Specifications Reference
Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.
3 categories
General Information
7 specs
General Information
7 specs
| Type | Laptop |
| Series | AMD Mobile Sempron |
| Designer | AMD |
| Launch Price | $69 |
| Release Date | 4 July 2008 (17 years ago) |
| Architecture Codename | Sable (2008−2009) |
| Performance Ranking Position | 3515 |
Technical Specifications
9 specs
Technical Specifications
9 specs
| Cores | 1 |
| Threads | 1 |
| L2 Cache | 512 kB |
| Bus Speed | 1800 MHz |
| Max Frequency | 2 GHz |
| 64-Bit Support | + |
| Process Technology | 65 nm |
| Max Core Temperature | 100 °C |
| Windows 11 Compatible | - |
Compatibility
3 specs
Compatibility
3 specs
| Socket | S1g2 |
| PCIe Generation | PCIe 2.0 |
| Power Consumption (TDP) | 512 kB |
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