PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Xeon X5570 is manufactured by Intel. It was released in 30 March 2009 (16 years ago). It is based on the Gainestown (2009−2010) architecture. It features 4 cores and 8 threads. Base frequency is 2.93 GHz, with boost up to 3.33 GHz. L3 cache: 8 MB (total). L2 cache: 256 kB (per core). Built on 45 nm process technology. Socket: LGA1366. Thermal design power (TDP): 95 Watt. Memory support: DDR3. Passmark benchmark score: 3,306 points. Launch price was $49.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.•
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

FPS Benchmarks

Predicted performance for Xeon X5570 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Technical Analysis

Detailed breakdown of Xeon X5570 specifications and capabilities.

⚡

Processing Power

The Xeon X5570 is a 4-core / 8-thread processor based on the Gainestown (2009−2010) architecture, manufactured on a 45 nm process node. It reaches a maximum boost clock of 3.33 GHz from a base frequency of 2.93 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 8 MB (total) of L3 cache, plus 256 kB (per core) of L2 cache and 64 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 3,306, placing it in the Entry Level performance tier as a Legacy generation product.

Specification	Xeon X5570
Cores / ThreadsPhysical/logical processing units	4C / 8T
Max Boost ClockPeak single-core speed under boost	3.33 GHz
Base ClockGuaranteed minimum operating frequency	2.93 GHz
ArchitectureCPU microarchitecture design	Gainestown (2009−2010)
Process NodeFabrication technology — smaller = more efficient	45 nm
L3 CacheShared cache — reduces memory latency for all cores	8 MB (total)
L2 CachePer-core fast cache for frequently accessed data	256 kB (per core)
L1 CacheUltra-fast per-core cache	64 kB (per core)
Die SizePhysical silicon area of the processor	263 mm2
Transistor CountMore transistors = more capabilities	731 million
Max TemperatureMaximum safe operating temperature (Tjmax)	75 °C
64-bit Support	Yes
Windows 11 Compatible	No
PassMark ScoreOverall multi-threaded benchmark score	3,306

🧠

Memory & Platform

The Xeon X5570 fits into the LGA1366 socket and supports PCIe 2.0. It supports DDR3 memory at speeds up to DDR3-1333 (faster RAM improves bandwidth-sensitive workloads) across 3 channels (dual-channel doubles bandwidth). It supports ECC memory, providing error-correcting capabilities — essential for mission-critical workloads and servers.

Specification	Xeon X5570
TypeDesktop or Laptop processor	server
SocketMotherboard socket required	LGA1366
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth	PCIe 2.0
RAM TypeSupported memory standard	DDR3
Max RAM SpeedMaximum officially supported memory frequency	DDR3-1333
RAM ChannelsDual-channel doubles bandwidth vs single-channel	3
ECC SupportError-Correcting Code memory — prevents data corruption	Yes
Integrated GPUBuilt-in graphics processor	No
Compatible ChipsetsMotherboard chipsets that support this CPU	Intel X58,Intel 5520
Max CPUs in ConfigMulti-socket support for servers	2

🔧

Advanced Features

The Xeon X5570 is primarily designed for Workstation. Virtualization: VT-x, VT-d, EPT — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Core i3-2100.

Specification	Xeon X5570
Primary Use CaseIntended workload category	Workstation
OverclockingWhether CPU clock can be manually increased	🔒 Locked
AVX-512Advanced vector instructions for AI/ML workloads	❌ Not Supported
VirtualizationHardware-assisted virtualization technology	VT-x, VT-d, EPT
Direct CompetitorMarket equivalent from rival manufacturer	Core i3-2100

🌡️

Power & Cooling

The Xeon X5570 has a rated TDP (Thermal Design Power) of 95 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. No stock cooler is included — you will need to purchase an aftermarket cooler separately. Recommended cooling: Tower 140mm.

Specification	Xeon X5570
TDPThermal Design Power — heat output under sustained workload	95 Watt
Max TemperatureMaximum safe junction temperature (Tjmax)	75 °C
Included CoolerStock cooler bundled in the box	No
Recommended CoolerSuggested aftermarket cooling solution	Tower 140mm

💰

Value Analysis

Performance ranking position: #2160 out of all indexed processors.

Specification	Xeon X5570
Launch PriceOriginal retail price at launch	$49
Performance RankPosition in overall performance ranking	#2160
Release DateLaunch date	30 March 2009 (16 years ago)
Release Year	2009
DesignerArchitecture designer (e.g. Intel, AMD)	Intel
ManufacturerFabrication foundry (e.g. TSMC)	Intel

Specifications Reference

Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.

4 categories

General Information

7 specs

Type	server
Designer	Intel
Launch Price	$49
Manufacturer	Intel
Release Date	30 March 2009 (16 years ago)
Architecture Codename	Gainestown (2009−2010)
Performance Ranking Position	2160

Technical Specifications

13 specs

Cores	4
Threads	8
Die Size	263 mm2
L1 Cache	64 kB (per core)
L2 Cache	256 kB (per core)
L3 Cache	8 MB (total)
Max Frequency	3.33 GHz
64-Bit Support	+
Base Frequency	2.93 GHz
Transistor Count	731 million
Process Technology	45 nm
Max Core Temperature	75 °C
Windows 11 Compatible	-