EPYC 7302P vs Ryzen AI 9 HX PRO 370
EPYC 7302P
Ryzen AI 9 HX PRO 370
Performance Spectrum - CPU
About PassMark
PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.
Value Upgrade Path
This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.
Avg price is the current average price collected from markets across the web.
Performance Per Dollar EPYC 7302P
Performance Per Dollar Ryzen AI 9 HX PRO 370
Performance Comparison
About PassMark🏆 Chipversus Verdict
🚀 Performance Leadership
| Insight | EPYC 7302P | Ryzen AI 9 HX PRO 370 |
|---|---|---|
| Gaming | ❌ Lower gaming performance | ✅ Superior gaming performance |
| Workstation | ❌ Weaker in multi-core tasks | ✅ Better multi-core power |
| Price | ✅ More affordable ($0) | ⚠️ Higher cost ($500) |
| Longevity | ✨ Modern (Zen 2 (2017−2020) / 7 nm, 14 nm) | ✨ Modern (Strix Point-HX PRO (Zen 5/5c) (2025) / 4 nm) |
💎 Value Proposition
| Insight | EPYC 7302P | Ryzen AI 9 HX PRO 370 |
|---|---|---|
| Cost Efficiency | ❌ Lower cost efficiency | ❌ Lower cost efficiency |
| Upfront Cost | ✅ More affordable ($0) | ⚠️ Higher cost ($500) |
Performance Check
To accurately isolate CPU performance, all benchmarks below use an NVIDIA RTX 4090 as the reference GPU. This eliminates GPU-side bottlenecks and highlights pure processing throughput differences between the CPUs.
Note: Real-world results may vary based on your actual GPU. CPU performance impact is more visible in processing-intensive titles and high-refresh-rate gaming scenarios.
Technical Specifications
Side-by-side comparison of EPYC 7302P and Ryzen AI 9 HX PRO 370
EPYC 7302P
The EPYC 7302P is manufactured by AMD. It was released in 7 August 2019 (6 years ago). It is based on the Zen 2 (2017−2020) architecture. It features 16 cores and 32 threads. Base frequency is 3 GHz, with boost up to 3.3 GHz. L3 cache: 32 MB (total). L2 cache: 512 kB (per core). Built on 7 nm, 14 nm process technology. Socket: SP3. Thermal design power (TDP): 155 Watt. Memory support: DDR4 Eight-channel. Passmark benchmark score: 32,690 points. Launch price was $825.
Ryzen AI 9 HX PRO 370
The Ryzen AI 9 HX PRO 370 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Point-HX PRO (Zen 5/5c) (2025) architecture. It features 12 cores and 24 threads. Base frequency is 2 GHz, with boost up to 5.1 GHz. L3 cache: 16 MB. L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP8. Thermal design power (TDP): 28 Watt. Memory support: DDR5. Passmark benchmark score: 32,841 points. Launch price was $499.
Processing Power
The EPYC 7302P packs 16 cores / 32 threads, while the Ryzen AI 9 HX PRO 370 offers 12 cores / 24 threads — the EPYC 7302P has 4 more cores. Boost clocks reach 3.3 GHz on the EPYC 7302P versus 5.1 GHz on the Ryzen AI 9 HX PRO 370 — a 42.9% clock advantage for the Ryzen AI 9 HX PRO 370 (base: 3 GHz vs 2 GHz). The EPYC 7302P uses the Zen 2 (2017−2020) architecture (7 nm, 14 nm), while the Ryzen AI 9 HX PRO 370 uses Strix Point-HX PRO (Zen 5/5c) (2025) (4 nm). In PassMark, the EPYC 7302P scores 32,690 against the Ryzen AI 9 HX PRO 370's 32,841 — a 0.5% lead for the Ryzen AI 9 HX PRO 370. L3 cache: 32 MB (total) on the EPYC 7302P vs 16 MB on the Ryzen AI 9 HX PRO 370.
| Feature | EPYC 7302P | Ryzen AI 9 HX PRO 370 |
|---|---|---|
| Cores / Threads | 16 / 32+33% | 12 / 24 |
| Boost Clock | 3.3 GHz | 5.1 GHz+55% |
| Base Clock | 3 GHz+50% | 2 GHz |
| L3 Cache | 32 MB (total)+100% | 16 MB |
| L2 Cache | 512 kB (per core) | 1 MB (per core)+100% |
| Process | 7 nm, 14 nm | 4 nm-43% |
| Architecture | Zen 2 (2017−2020) | Strix Point-HX PRO (Zen 5/5c) (2025) |
| PassMark | 32,690 | 32,841 |
| Cinebench R23 Multi | 11,500 | — |
| Geekbench 6 Single | 1,320 | — |
| Geekbench 6 Multi | 11,450 | — |
Memory & Platform
The EPYC 7302P uses the SP3 socket (PCIe 4.0), while the Ryzen AI 9 HX PRO 370 uses FP8 (PCIe 4.0) — making them incompatible on the same motherboard. Maximum memory speed reaches DDR4-3200 on the EPYC 7302P versus LPDDR5X-8000 on the Ryzen AI 9 HX PRO 370 — the Ryzen AI 9 HX PRO 370 supports 22.2% faster memory, which can translate to measurable gains in memory-sensitive workloads. The EPYC 7302P supports up to 4096 GB of RAM compared to 64 GB — 193.8% more capacity for professional workloads. Memory channels: 8 (EPYC 7302P) vs 2 (Ryzen AI 9 HX PRO 370). PCIe lanes: 128 (EPYC 7302P) vs 20 (Ryzen AI 9 HX PRO 370) — the EPYC 7302P offers 108 more lanes for additional GPUs or NVMe drives.
| Feature | EPYC 7302P | Ryzen AI 9 HX PRO 370 |
|---|---|---|
| Socket | SP3 | FP8 |
| PCIe Generation | PCIe 4.0 | PCIe 4.0 |
| Max RAM Speed | DDR4-3200 | LPDDR5X-8000+25% |
| Max RAM Capacity | 4096 GB+6300% | 64 GB |
| RAM Channels | 8+300% | 2 |
| ECC Support | ✅ | ✅ |
| PCIe Lanes | 128+540% | 20 |
Advanced Features
Neither processor supports overclocking. Only the Ryzen AI 9 HX PRO 370 supports AVX-512 instructions — important for machine learning and scientific applications. Virtualization support: AMD-V, SEV (EPYC 7302P) vs AMD-V (Ryzen AI 9 HX PRO 370). The Ryzen AI 9 HX PRO 370 includes integrated graphics (Radeon 890M), while the EPYC 7302P requires a dedicated GPU. Primary use case: EPYC 7302P targets Server / Virtualization, Ryzen AI 9 HX PRO 370 targets Mobile Workstation / AI. Direct competitor: EPYC 7302P rivals Xeon Gold 6230.
| Feature | EPYC 7302P | Ryzen AI 9 HX PRO 370 |
|---|---|---|
| Integrated GPU | No | Yes |
| IGPU Model | — | Radeon 890M |
| Unlocked | No | No |
| AVX-512 | No | Yes |
| Virtualization | AMD-V, SEV | AMD-V |
| Target Use | Server / Virtualization | Mobile Workstation / AI |
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