PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Xeon X7350 is manufactured by Intel. It was released in 6 September 2007 (18 years ago). It is based on the Tigerton (2007) architecture. It features 6 cores and 6 threads. Base frequency is 2.93 GHz, with boost up to 0.93 GHz. L3 cache: 8 MB L2 Cache. L2 cache: 4 MB (total). Built on 65 nm process technology. Socket: PGA604. Thermal design power (TDP): 130 Watt. Memory support: DDR2, DDR3. Passmark benchmark score: 7,836 points. Launch price was $2,301.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.•
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

FPS Benchmarks

Predicted performance for Xeon X7350 across popular games. Tested paired with RTX 4090 to isolate CPU performance.

Technical Analysis

Detailed breakdown of Xeon X7350 specifications and capabilities.

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Processing Power

The Xeon X7350 is a 6-core / 6-thread processor based on the Tigerton (2007) architecture, manufactured on a 65 nm process node. It reaches a maximum boost clock of 0.93 GHz from a base frequency of 2.93 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 8 MB L2 Cache of L3 cache, plus 4 MB (total) of L2 cache and 64 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 7,836, placing it in the Entry Level performance tier as a Legacy generation product.

Specification	Xeon X7350
Cores / ThreadsPhysical/logical processing units	6C / 6T
Max Boost ClockPeak single-core speed under boost	0.93 GHz
Base ClockGuaranteed minimum operating frequency	2.93 GHz
ArchitectureCPU microarchitecture design	Tigerton (2007)
Process NodeFabrication technology — smaller = more efficient	65 nm
L3 CacheShared cache — reduces memory latency for all cores	8 MB L2 Cache
L2 CachePer-core fast cache for frequently accessed data	4 MB (total)
L1 CacheUltra-fast per-core cache	64 kB (per core)
Die SizePhysical silicon area of the processor	2x 143 mm2
Transistor CountMore transistors = more capabilities	582 million
64-bit Support	Yes
Windows 11 Compatible	No
Core Voltage Range	1V-1.5V
PassMark ScoreOverall multi-threaded benchmark score	7,836

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Memory & Platform

The Xeon X7350 fits into the PGA604 socket and supports PCIe 2.0. It supports DDR2, DDR3 memory at speeds up to DDR2-667 (faster RAM improves bandwidth-sensitive workloads) across 4 channels (dual-channel doubles bandwidth). It supports ECC memory, providing error-correcting capabilities — essential for mission-critical workloads and servers.

Specification	Xeon X7350
TypeDesktop or Laptop processor	server
SocketMotherboard socket required	PGA604
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidth	PCIe 2.0
RAM TypeSupported memory standard	DDR2, DDR3
Max RAM SpeedMaximum officially supported memory frequency	DDR2-667
RAM ChannelsDual-channel doubles bandwidth vs single-channel	4
ECC SupportError-Correcting Code memory — prevents data corruption	Yes
Integrated GPUBuilt-in graphics processor	No
Compatible ChipsetsMotherboard chipsets that support this CPU	Intel 7300
Max CPUs in ConfigMulti-socket support for servers	4

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Advanced Features

The Xeon X7350 is primarily designed for Server. Virtualization: VT-x — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Core i3-2100.

Specification	Xeon X7350
Primary Use CaseIntended workload category	Server
OverclockingWhether CPU clock can be manually increased	🔒 Locked
AVX-512Advanced vector instructions for AI/ML workloads	❌ Not Supported
VirtualizationHardware-assisted virtualization technology	VT-x
Direct CompetitorMarket equivalent from rival manufacturer	Core i3-2100

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Power & Cooling

The Xeon X7350 has a rated TDP (Thermal Design Power) of 130 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. No stock cooler is included — you will need to purchase an aftermarket cooler separately. Recommended cooling: Tower 140mm.

Specification	Xeon X7350
TDPThermal Design Power — heat output under sustained workload	130 Watt
Included CoolerStock cooler bundled in the box	No
Recommended CoolerSuggested aftermarket cooling solution	Tower 140mm

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Value Analysis

Performance ranking position: #1472 out of all indexed processors.

Specification	Xeon X7350
Launch PriceOriginal retail price at launch	$2,301
Performance RankPosition in overall performance ranking	#1472
Release DateLaunch date	6 September 2007 (18 years ago)
Release Year	2007
DesignerArchitecture designer (e.g. Intel, AMD)	Intel
ManufacturerFabrication foundry (e.g. TSMC)	Intel

Specifications Reference

Raw spec sheet for quick lookup. The analysis cards above explain what these fields mean in practice.

4 categories

General Information

7 specs

Type	server
Designer	Intel
Launch Price	$2,301
Manufacturer	Intel
Release Date	6 September 2007 (18 years ago)
Architecture Codename	Tigerton (2007)
Performance Ranking Position	1472

Technical Specifications

14 specs

Cores	6
Threads	6
Die Size	2x 143 mm2
L1 Cache	64 kB (per core)
L2 Cache	4 MB (total)
L3 Cache	8 MB L2 Cache
Max Frequency	0.93 GHz
64-Bit Support	+
Base Frequency	2.93 GHz
Transistor Count	582 million
Process Technology	65 nm
Allowed Core Voltage	1V-1.5V
Windows 11 Compatible	-
Max Case Temperature (TCase)	64 °C