Ryzen AI Max 385
CPU·Mid-Range

Ryzen AI Max 385

AMD

PassMark

32,274

00
6 January 2025 (less than a year ago)
55 Watt
Strix Halo (2025)

Performance Spectrum - CPU

About PassMark

PassMark CPU Mark evaluates processor speed through complex mathematical computations. It provides a reliable metric to compare multi-core performance, where higher scores indicate faster processing for multitasking, gaming, and heavy workloads.

Overview

The Ryzen AI Max 385 is manufactured by AMD. It was released in 6 January 2025 (less than a year ago). It is based on the Strix Halo (2025) architecture. It features 8 cores and 16 threads. Base frequency is 3.6 GHz, with boost up to 5 GHz. L3 cache: 32 MB (total). L2 cache: 1 MB (per core). Built on 4 nm process technology. Socket: FP11. Thermal design power (TDP): 55 Watt. Memory support: DDR5. Passmark benchmark score: 32,274 points. Launch price was $499.

Value Upgrade Path

This is the official ChipVERSUS Value Rating, comparing raw performance (PassMark) per dollar. Components placed above yours deliver better value for money.

MSRP is the manufacturer's suggested retail price.
Avg price is the current average price collected from markets across the web.

Performance Per Dollar

Based on actual market prices and performance synthetic scores.

Technical Analysis

Detailed breakdown of Ryzen AI Max 385 specifications and capabilities.

Processing Power

The Ryzen AI Max 385 is a 8-core / 16-thread processor based on the Strix Halo (2025) architecture, manufactured on a 4 nm process node. It reaches a maximum boost clock of 5 GHz from a base frequency of 3.6 GHz— higher boost clocks directly translate to better single-threaded performance and responsiveness in gaming. It carries 32 MB (total) of L3 cache, plus 1 MB (per core) of L2 cache and 80 kB (per core) of L1 cache per core. In the PassMark benchmark (a comprehensive multi-threaded test), it scores 32,274, placing it in the High-End performance tier as a Current Gen generation product. Geekbench 6 single-core (the most relevant metric for gaming FPS) records 2,800, while multi-core reaches 14,000. Cinebench R23 multi-core (measuring sustained rendering workload performance) scores 16,500.

SpecificationRyzen AI Max 385
Cores / ThreadsPhysical/logical processing units8C / 16T
Max Boost ClockPeak single-core speed under boost5 GHz
Base ClockGuaranteed minimum operating frequency3.6 GHz
ArchitectureCPU microarchitecture designStrix Halo (2025)
Process NodeFabrication technology — smaller = more efficient4 nm
L3 CacheShared cache — reduces memory latency for all cores32 MB (total)
L2 CachePer-core fast cache for frequently accessed data1 MB (per core)
L1 CacheUltra-fast per-core cache80 kB (per core)
Die SizePhysical silicon area of the processor2x 70.6 mm2
64-bit SupportYes
PassMark ScoreOverall multi-threaded benchmark score32,274
Cinebench R23 MultiSustained multi-core rendering performance16,500
Geekbench 6 SingleSingle-core performance — most relevant for gaming2,800
Geekbench 6 MultiMulti-core parallel workload performance14,000
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Memory & Platform

The Ryzen AI Max 385 fits into the FP11 socket and supports PCIe 4.0 with 20 total PCIe lanes for expansion cards and storage. It supports DDR5 memory at speeds up to LPDDR5x-8000 (faster RAM improves bandwidth-sensitive workloads), with a maximum capacity of 128 GB across 4 channels (dual-channel doubles bandwidth). Integrated graphics: Radeon 8050S — allows display output without a dedicated GPU, useful for troubleshooting and light tasks.

SpecificationRyzen AI Max 385
TypeDesktop or Laptop processorLaptop
SocketMotherboard socket requiredFP11
PCIe GenerationPeripheral interconnect speed — affects GPU and SSD bandwidthPCIe 4.0
PCIe LanesTotal available lanes for GPUs, NVMe drives, and expansion20
RAM TypeSupported memory standardDDR5
Max RAM SpeedMaximum officially supported memory frequencyLPDDR5x-8000
Max RAM CapacityMaximum installable memory128 GB
RAM ChannelsDual-channel doubles bandwidth vs single-channel4
ECC SupportError-Correcting Code memory — prevents data corruptionNo
Integrated GPUBuilt-in graphics processorRadeon 8050S
Compatible ChipsetsMotherboard chipsets that support this CPUStrix Halo platform
Max CPUs in ConfigMulti-socket support for servers1
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Advanced Features

The Ryzen AI Max 385 is primarily designed for High-performance AI / Gaming Laptop. It features an unlocked multiplier, allowing enthusiasts to overclock beyond stock frequencies for additional performance. It supports AVX-512 instructions — specialized SIMD operations that significantly accelerate AI inference, scientific computing, and video encoding workloads. Virtualization: AMD-V — enables running virtual machines efficiently (important for development and server workloads). Its primary market competitor is the Core Ultra 9 285H.

SpecificationRyzen AI Max 385
Primary Use CaseIntended workload categoryHigh-performance AI / Gaming Laptop
OverclockingWhether CPU clock can be manually increased✅ Unlocked
AVX-512Advanced vector instructions for AI/ML workloads✅ Supported
VirtualizationHardware-assisted virtualization technologyAMD-V
Direct CompetitorMarket equivalent from rival manufacturerCore Ultra 9 285H
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Power & Cooling

The Ryzen AI Max 385 has a rated TDP (Thermal Design Power) of 55 Watt — this indicates the amount of heat generated under sustained load and determines what cooling solution is needed. It ships with the Laptop Integrated stock cooler. Recommended cooling: Enthusiast Mobile Cooling.

SpecificationRyzen AI Max 385
TDPThermal Design Power — heat output under sustained workload55 Watt
Included CoolerStock cooler bundled in the boxLaptop Integrated
Recommended CoolerSuggested aftermarket cooling solutionEnthusiast Mobile Cooling
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Value Analysis

Performance ranking position: #385 out of all indexed processors.

SpecificationRyzen AI Max 385
MSRPManufacturer's Suggested Retail Price$0
Avg Price (30d)Average market price over the last 30 days$0
Launch PriceOriginal retail price at launch$499
Performance RankPosition in overall performance ranking#385
Release DateLaunch date6 January 2025 (less than a year ago)
Release Year2025
DesignerArchitecture designer (e.g. Intel, AMD)AMD
ManufacturerFabrication foundry (e.g. TSMC)TSMC

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